发明名称 LIGHT-EMITTING DIODE PACKAGE AND STRUCTURE OF LEAD GROUPS FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting diode package that has a large quantity of light and can efficiently condense light emitted from each light-emitting diode chip. <P>SOLUTION: The light-emitting diode package 1 has a group of diodes 2D to which a plurality of light-emitting diode chips 2 are connected in series, and a group of leads 3 connected to the group of diodes 2D. The group of leads 3 has a pair of external leads 31, 32 that becomes the terminals of the group of diodes 2D, and auxiliary leads 33, where the number of the auxiliary leads 33 is smaller than that of light-emitting diode chips 2 by one. The plurality of light-emitting diode chips 2 are arranged in a line on the external lead 31 of the pair of external leads 31, 32. The auxiliary leads 33 are arranged at one side or both the sides of a line comprising the plurality of light-emitting diode chips 2. The mutually adjacent light-emitting diode chips 2 in the plurality of light-emitting diode chips 2 are connected in series via the auxiliary leads 33. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008172152(A) 申请公布日期 2008.07.24
申请号 JP20070006003 申请日期 2007.01.15
申请人 SHOWA DENKO KK 发明人 YASUDA TAKENORI
分类号 H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/54
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