| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a light-emitting diode device preventing a light-emitting diode epitaxy layer from being damaged when separating the light-emitting diode epitaxy layer from a non-conductive substrate. <P>SOLUTION: The light-emitting diode device is used for the non-conductive substrate growing a light-emitting diode, forms upper and lower electrodes instantly without removing the non-conductive substrate, and conducts electricity vertically. On the surface of the light-emitting diode epitaxy layer on the non-conductive substrate, a conductive substrate is formed by electroplating or junction, thus manufacturing a light-emitting diode chip. After that, a subsequent manufacturing process, where the light-emitting diode chip is cut for producing a plurality of light-emitting diode sticks, is performed to form a plurality of light-emitting diode devices. <P>COPYRIGHT: (C)2008,JPO&INPIT |
