IMAGING DEVICE, AND ENDOSCOPE

摘要

An imaging device comprising a solid imaging element chip (32), an FPC (43) the terminal of which is connected to the solid imaging element chip (32), and electronic parts (70, 71, 72) mounted on the surface (43i) of the FPC (43), characterized in that the FPC (43) is so disposed in a folded state at the rear of the rear surface (32h) of the solid imaging chip (32) that the mounting surfaces of the electronic parts (70, 71, 72) are constituted of multiple layers and the electronic parts (70, 71, 72) are superoposed on each other through the FPC (43).