发明名称 MANUFACTURING METHOD FOR ELASTIC BOUNDARY WAVE DEVICE
摘要 <p>Provided is a method for manufacturing an elastic boundary wave device, in which a discontinuous portion is hardly formed in a dielectric film thereby to deteriorate the electric characteristics hardly, although an IDT is not thinned so much, in case the dielectric film is formed by a deposition method. In the elastic boundary wave device manufacturing method, a lower dielectric film (5) is so formed over a piezoelectric substrate (1), after an IDT (4) was formed, as to cover the IDT (4). A flattening step is executed to reduce the corrugations of the upper face of the lower dielectric film (5). An upper dielectric film (7) is formed to cover the lower dielectric film (5) having the corrugation-reduced upper face.</p>
申请公布号 WO2008087836(A1) 申请公布日期 2008.07.24
申请号 WO2007JP74919 申请日期 2007.12.26
申请人 MURATA MANUFACTURING CO., LTD.;KANDO, HAJIME;NODAKE, NAOHIRO;SAEKI, MASAHIKO;FUYUTSUME, TOSHIYUKI 发明人 KANDO, HAJIME;NODAKE, NAOHIRO;SAEKI, MASAHIKO;FUYUTSUME, TOSHIYUKI
分类号 H03H3/08;H03H9/145 主分类号 H03H3/08
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