HOUSING FOR MICROMECHANICAL AND MICRO-OPTIC COMPONENTS USED IN MOBILE APPLICATIONS

摘要

The invention relates to a housing for one or more micro-mechanical and/o r micro-optical components. Said housing comprises a carrier substrate havin g at least one micro-mechanical and/or micro-optical component and at least one cover substrate that is connected to the carrier substrate. The carrier substrate and the at least one cover substrate form at least one cavity that at least partially surrounds the at least one micro-mechanical and/or micro -optical component. The side of the at least one cover substrate facing the at least on micro-mechanical and/or micro-optical component comprises at lea st one optical window and at least one mechanical stop. The invention also r elates to a method for producing said type of housing and said method can al so be used, in particular, for encapsulating wafer planes.