MACHINING APPARATUS AND SEMICONDUCTOR STRIP MACHINING SYSTEM USING THE SAME
摘要
A machining apparatus and a semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit (302) including a pair of chuck tables (304) simultaneously movable in an X-axis direction while being individually movable in Y-axis direction, and a cutting unit (320) for machining articles respectively seated on the chuck tables (304).
申请公布号
WO2008044840(A3)
申请公布日期
2008.07.24
申请号
WO2007KR04871
申请日期
2007.10.05
申请人
HANMISEMICONDUCTOR CO., LTD;NA, IK KYUN;JUNG, HYUN GYUN;YOUN, WOONG HWAN