发明名称 MACHINING APPARATUS AND SEMICONDUCTOR STRIP MACHINING SYSTEM USING THE SAME
摘要 A machining apparatus and a semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit (302) including a pair of chuck tables (304) simultaneously movable in an X-axis direction while being individually movable in Y-axis direction, and a cutting unit (320) for machining articles respectively seated on the chuck tables (304).
申请公布号 WO2008044840(A3) 申请公布日期 2008.07.24
申请号 WO2007KR04871 申请日期 2007.10.05
申请人 HANMISEMICONDUCTOR CO., LTD;NA, IK KYUN;JUNG, HYUN GYUN;YOUN, WOONG HWAN 发明人 NA, IK KYUN;JUNG, HYUN GYUN;YOUN, WOONG HWAN
分类号 H01L21/00;B28D5/00;H01L21/68;H01L21/78 主分类号 H01L21/00
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