PACKAGE FOR LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING DIODE USING PACKAGE

摘要

PROBLEM TO BE SOLVED: To enhance heat dissipation characteristics of a light emitting diode or a package for a light emitting diode while reducing the thickness thereof.

SOLUTION: A package for a light emitting diode is produced by attaching a cover body having an opening for housing a light emitting diode element on a base body having a wiring pattern for mounting the light emitting diode element. In the package or a light emitting diode using the package, the base body is formed by laying a sheet-like electrode layer and a sheet-like heat dissipation layer with a sheet-like insulating layer interposed therebetween. An opening is formed in the insulating layer to form an bonding area for bonding the light emitting diode element to the surface of the heat dissipation layer.

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