| 发明名称 |
CMOS image sensors with a bonding pad and methods of forming the same |
| 摘要 |
A CMOS image sensor with a bonding pad comprises a semiconductor substrate having a pixel region and a circuit region; a passivation layer having an opening over the semiconductor substrate; and a bonding pad in circuit region, the bonding pad without extending to an upper surface of the passivation layer.
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| 申请公布号 |
US2008173904(A1) |
申请公布日期 |
2008.07.24 |
| 申请号 |
US20070655856 |
申请日期 |
2007.01.22 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIU MING-CHYI;FU SHIH-CHI;LIU YUAN-HUNG;CHEN WEI-CHIH;LO CHI-HSIN |
| 分类号 |
H01L27/148 |
主分类号 |
H01L27/148 |
| 代理机构 |
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