发明名称 Self-aligned methods based on low-temperature selective epitaxial growth for fabricating silicon carbide devices
摘要 Self-aligned fabrication of silicon carbide semiconductor devices is a desirable technique enabling reduction in the number of photolithographic steps, simplified alignment of different device regions, and reduced spacing between the device regions. This invention provides a method of fabricating silicon carbide (SiC) devices utilizing low temperature selective epitaxial growth which allows avoiding degradation of many masking materials attractive for selective epitaxial growth. Another aspect of this invention is a combination of the low temperature selective epitaxial growth of SiC and self-aligned processes.
申请公布号 US2008173875(A1) 申请公布日期 2008.07.24
申请号 US20070787144 申请日期 2007.04.13
申请人 KOSHKA YAROSLAV;MELNYCHUK GALYNA 发明人 KOSHKA YAROSLAV;MELNYCHUK GALYNA
分类号 H01L21/04;H01L29/15 主分类号 H01L21/04
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