发明名称 APPARATUS AND METHODS FOR FABRICATION OF THIN FILM ELECTRONIC DEVICES AND CIRCUITS
摘要 <p>Methods and systems for forming layered electronic devices on a flexible, elongated substrate are described. The layered electronic devices include at least one electronically or optically active layer. Deposition of one more layers of the electronic devices occurs as the flexible substrate is moved through one or more deposition stations. At each deposition station the substrate is aligned with an aperture mask having apertures arranged in a pattern. The aperture mask and the substrate are brought into proximity over a portion of a circumference of a rotating drum. A layer of the layered electronic devices is formed by deposition of material through the apertures of the aperture mask. At each deposition station, registration between at least two layers of the layered electronic devices is maintained.</p>
申请公布号 WO2008088932(A1) 申请公布日期 2008.07.24
申请号 WO2008US50103 申请日期 2008.01.03
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 TOKIE, JEFFREY, H.;MCCLURE, DONALD, J.;CARLSON, DANIEL, H.;DOBBS, JAMES, N.;STRAND, JOHN, T.;SWANSON, RONALD, P.
分类号 H01L51/00;B41F15/08 主分类号 H01L51/00
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