| 摘要 |
<p>The invention relates to a cooling device for cooling a semiconductor component ( 1 ), in particular an optoelectronic semiconductor component, comprising at least partially first and second layers and a heal dissipation device ( 4 ), wherein said first and second layers are flatly placed on top of each other and one layer is provided, at least partially, with a structure for receiving said heat dissipation device ( 4 ).</p> |
