发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can improve a manufacturing yield by precisely detecting the occurrence of electrostrictive cracks to perform screening properly. SOLUTION: A withstand voltage test and a crack test are performed on a multilayer ceramic capacitor 1 (object to be tested) (Step S13). In these tests, a predetermined test voltage exceeding the rated voltage of the multilayer ceramic capacitor is applied to the capacitor to check if there is dielectric breakdown or rupture (withstand voltage test) and it is checked if there is electrostrictive cracks in the object to be tested (crack test). Based on the results of these tests, the object to be tested is screened. In the crack test, an amount of displacement of the object to be tested in the stacking direction is measured before applying the predetermined test voltage as the withstand voltage test. Then, it is determined if there are cracks or not based on the rate of change of the amount of displacement nearly at the center P of the measurement plane of the object to be tested 7 and then the object to be tested is screened. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008171949(A) 申请公布日期 2008.07.24
申请号 JP20070002630 申请日期 2007.01.10
申请人 TDK CORP 发明人 NATSUI HIDESADA;AOKI TAKASHI
分类号 H01G13/00;H01G4/12;H01G4/30 主分类号 H01G13/00
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