METHOD AND DEVICE OF INSPECTING SOLID-STATE IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the method of inspecting a semiconductor wafer by which a plurality of solid-state imaging devices formed on a semiconductor wafer can be optically and electrically inspected as a wafer at the same time. SOLUTION: A solid-state imaging device wafer 21 is sucked to a contactor 241 comprised of a contactor frame 181 and a sheet frame 221 by reducing pressure, so as to connect the external connection electrode 131 of each of the solid-state imaging devices 11 with the anisotropic conductive member 211 of the contactor 241. Light is given to the main side of the solid-state imaging device wafer 21 to inspect all solid-state imaging devices 11 as a wafer at the same time. COPYRIGHT: (C)2008,JPO&INPIT