APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

An apparatus for mounting an electronic component is provided with one wafer stage (7) for supplying a semiconductor chip (4); a first inverting unit (17) and a second inverting unit (18), which pick up the semiconductor chip on the wafer stage and then invert the semiconductor chip; a first mounting unit (31) which receives the semiconductor chip inverted by the first inverting unit and mounts the semiconductor chip on a board; and a second mounting unit (33) which receives the semiconductor chip inverted by a second inverting pickup tool and mounts the semiconductor chip on the board.