| 摘要 |
A semiconductor module is provided to improve the reliability of a module or product by preventing solder failure of a signal pin due to stress. A semiconductor module includes at least one ground pin(122,125), at least one signal pin(124), and a corner signal pin(123). At least one ground pin is disposed on a bottom layer(120). At least one signal pin is disposed on the bottom layer. When the ground pin and the signal pin are disposed on a corner part of the bottom layer, the corner signal pin is disposed at an inner direction more than an end of a pin in a different disposition direction. A ground pin or a dummy pin is disposed in the other corner part of the bottom layer. |
