| 摘要 |
A method for plating a pattern of a printed wiring substrate is provided to facilitate permeation of resist etching solution for removing the resist by forming a minute gap between a resist and a plate lead layer. A method for plating a pattern of a printed wiring substrate includes the steps of: seating a rear surface of a printed wiring substrate patterned with a plating resist(14) on a concave surface by including a plating jig with the concave surface; and removing a resist by using solution for removing the resist after forming a minute gap between the resist and a plate lead layer(15) by separating the printed wiring substrate from the jig with the concave surface. At least one conductive thin-film layer is formed on a flexible insulating substrate(11). After a plating resist is applied on the conductive thin-film layer, the conductive thin-film layer applied with the plating resist is exposed and at least one conductive layer is formed in the exposed pattern area.
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