Circuit carrier laminate and circuit carrier for mounting a semiconductor chip of a smartcard module, and manufacturing methods thereof

摘要

The present invention relates to a circuit carrier laminate (100) and a circuit carrier for mounting a semiconductor chip (30) of a smart card module (40), as well as to a smart card module (40) comprising a semiconductor chip (30) and such a circuit carrier. A circuit carrier laminate comprises a contact lead-frame (10) having a first surface that is adapted to electrically contact the semiconductor chip (30) and a second surface that is formed to establish an electrical contact of the smart card module (40) to an external component. In order to obtain a smart card module having a reduced size while guaranteeing reduced production costs, a laminated electrically non-conductive layer (20) is arranged on the second surface of the contact lead-frame (10) that is removable after mounting the semiconductor chip (30) on the circuit carrier.