A camera module is provided to minimize damage of an image sensor by preventing a top surface of the image sensor from being in direct contact with a lower end of a wafer lens or a lower end of a lens holder with in determining a focus length with respect to the top surface of the image sensor. A camera module includes a flexible printed circuit board(110), an image sensor(120), and a wafer lens(130). The flexible printed circuit board includes a window(111) on a central portion and a connector at one end. The image sensor includes a light receiving unit(121) on a central portion and is flip-chip- bonded to a lower par of the flexible printed circuit board to expose the light receiving unit through the window of the printed circuit board. The wafer lens is received on a top surface of the printed circuit board and includes an aperture(131) on a top surface.
