发明名称 Secondary battery protecting module and lead mounting method
摘要 <p>In a lead mounting method of mounting, onto a principal surface (11a) of a printed board (11), a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part (21a,22a) to be disposed on the principal surface of the printed board and a connected part (21b,22b) to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead (21,22). The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering. Such a method is useful for a secondary battery protection module (10). </p>
申请公布号 EP1708553(A3) 申请公布日期 2008.07.23
申请号 EP20050113090 申请日期 2005.12.30
申请人 MITSUMI ELECTRIC CO., LTD. 发明人 TAKEDA, ITARU;KATO, TOMOYUKI;SHOJI, YASUO
分类号 H05K3/34;H01M2/10 主分类号 H05K3/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利