发明名称 |
Secondary battery protecting module and lead mounting method |
摘要 |
<p>In a lead mounting method of mounting, onto a principal surface (11a) of a printed board (11), a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part (21a,22a) to be disposed on the principal surface of the printed board and a connected part (21b,22b) to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead (21,22). The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
Such a method is useful for a secondary battery protection module (10).
</p> |
申请公布号 |
EP1708553(A3) |
申请公布日期 |
2008.07.23 |
申请号 |
EP20050113090 |
申请日期 |
2005.12.30 |
申请人 |
MITSUMI ELECTRIC CO., LTD. |
发明人 |
TAKEDA, ITARU;KATO, TOMOYUKI;SHOJI, YASUO |
分类号 |
H05K3/34;H01M2/10 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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