| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high reliability at the joint of conductive members and a bonding method thereof, a mounting and bonding method of a mounting component, an electronic component, a circuit board and an electronic apparatus. SOLUTION: The bonding method of wiring board comprises a first step for providing an adhesive material 30 on a first board on which a first wiring pattern 12 is formed, a second step for bonding first and second wiring patterns 12, 22 by bonding first and second boards 10, 20 tightly through the adhesive material 30 while preventing it from hardening and bringing the first and second wiring patterns 12, 22 into contact thereby forming a metal joint, and a third step for securing the first and second boards 10, 20 by developing adherence of the adhesive material 30. |
