Solder composition

摘要

A solder composition having a lead-free SnZn alloy and a soldering flux containing at least an epoxy resin and an organic carboxylic acid, characterized in that the organic carboxylic acid has a molecular weight of 100 to 200 g/mol, and that the solder flux contains an alcohol. The solder composition requires no washing for removing a flux residue and also a cream solder from the composition is less prone to the change of its viscosity, printing characteristics, solderability or the like with the elapse of time after the preparation thereof.