| 摘要 |
<p>A method for manufacturing an electronic device is provided to improve reliability of the electronic device mounting a circuit chip on a film type substrate by restricting generation of voids. Thermosetting adhesive is coated on a surface, which includes a conductive pattern(112), of a substrate(11). The substrate is formed by including the conductive pattern formed on a film(111) made of a polymer material. A circuit chip(12) connecting to the conductive pattern is put on the substrate through the thermosetting adhesive. The substrate is inserted between a circuit chip side and a film side by a heater(2) heating the thermosetting adhesive, and having a pressing part contacting with the circuit chip side and a supporter supporting the substrate by contacting with the film. Tension of a direction for extending the film is applied on the substrate on which the circuit chip is mounted. The circuit chip is fixed on the conductive pattern by curing the thermosetting adhesive with heat generated from the heater.</p> |
