发明名称 |
Method for forming a coating with a liquid, and method for manufacturing a semiconductor device |
摘要 |
<p>A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.</p> |
申请公布号 |
EP1947680(A2) |
申请公布日期 |
2008.07.23 |
申请号 |
EP20070111688 |
申请日期 |
2007.07.03 |
申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
MURAMATSU, TOMOAKI;KAIMOTO, YUKO;OMATA, ICHIRO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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