发明名称 |
DIAMOND TOOL |
摘要 |
A segment type diamond tool has diamond particles appropriately distributed on segments of the diamond tool, thereby providing an excellent cutting rate and reducing fine debris generated during a cutting operation. The diamond tool comprises a plurality of segments, each of the segments having a single plate- shaped layer or a plurality of plate-shaped layers of diamond particles arranged thereon, and the layers of diamond particles being arranged on the segment such that cutting grooves formed on a workpiece by a trailing layer of diamond particles are arranged between cutting grooves formed thereon by a leading layer of diamond particles, respectively, during a cutting operation on the workpiece, wherein the diamond particles are arranged at a predetermined tilt angle to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface, so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment during the cutting operation on the workpiece.
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申请公布号 |
CA2500192(C) |
申请公布日期 |
2008.07.15 |
申请号 |
CA20042500192 |
申请日期 |
2004.08.10 |
申请人 |
EHWA DIAMOND INDUSTRIAL, CO., LTD;GENERAL TOOL, INC. |
发明人 |
KIM, SOO-KWANG;KIM, JONG-HO;PARK, HEE-DONG |
分类号 |
B23D61/02;B22F3/00;B22F7/06;B23D61/18;B23D63/02;B24D5/12;B26D;B28D1/04;B28D1/12;C22C26/00 |
主分类号 |
B23D61/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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