发明名称 Embedded strain layer in thin SOI transistors and a method of forming the same
摘要 By forming a deep recess through the buried insulating layer and re-growing a strained semiconductor material, an enhanced strain generation mechanism may be provided in SOI-like transistors. Consequently, the strain may also be efficiently created by the embedded strained semiconductor material across the entire active layer, thereby significantly enhancing the performance of transistor devices, in which two channel regions may be defined.
申请公布号 US7399663(B2) 申请公布日期 2008.07.15
申请号 US20060466572 申请日期 2006.08.23
申请人 ADVANCED MICRO DEVICES, INC. 发明人 HOENTSCHEL JAN;WEI ANDY;HORSTMANN MANFRED;KAMMLER THORSTEN
分类号 H01L21/00;H01L21/336 主分类号 H01L21/00
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