SEMICONDUCTOR MEMORY DEVICE AND TEST METHOD THEREOF

摘要

A semiconductor memory device and a method for testing the same are provided to secure contacting states of pads by increasing a pad size and a pad pitch in a wafer test process. A plurality of internal circuits are formed in a die. A plurality of first and second channel pads(20-1 to 20-(N+1),30-1 to 30-(N+1)) having a first pad size and a first pad pitch are alternately arranged in parallel to each other on a straight line of the die. The first and second channel pads alternately and selectively come in contact with test probes(150-1 to 150(N+1)) in order to receive a wafer test signal from the outside and to output signals of the internal circuits to the outside. A probe card is formed at an interval of the first or the second channel pads in order to test the first or the second channel pads.