发明名称 METHOD OF MANUFACTURING LAMINATED LEAD FRAME AND LAMINATED LEAD FRAME PRODUCED BY THE METHOD
摘要 A method for manufacturing a laminated lead frame in which each lead frame unit plate to be laminated can be bonded surely with a relatively small load. A laminated lead frame is also provided. In the method for manufacturing a lead frame by laminating and bonding a plurality of lead frame unit plates (10, 12) subjected to predetermined shaping, a plurality of protrusions (12) are formed on one of the opposing surfaces of a pair of upper and lower lead frame unit plates (10, 11) and the opposing lead frame unit plates (11, 12) are bonded together through the protrusions (12).
申请公布号 KR20080065966(A) 申请公布日期 2008.07.15
申请号 KR20087004184 申请日期 2008.02.21
申请人 MITSUI HIGH-TEC, INC. 发明人 MATSUNAGA KIYOSHI;MIMURA CHIKAYA;SHIOYAMA TAKAO
分类号 H01L23/50;H01L23/48 主分类号 H01L23/50
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