| 摘要 |
This invention provides a semiconductor film manufacturing method using a new separation technique and applications thereof. The semiconductor film manufacturing method of this invention includes a separation layer forming a step of hetero-epitaxially growing a separation layer ( 2 ) on a seed substrate ( 1 ), a semiconductor film forming step of forming a semiconductor film ( 3 ) on the separation layer ( 2 ), and a separation step of separating, by using the separation layer ( 2 ), the semiconductor film ( 3 ) from a composite member (Ia) formed in the semiconductor film forming step.
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