| 摘要 |
Equipment for fabricating a semiconductor device is provided to avoid a decrease of the operating rate of equipment caused by holding of the equipment by easily replacing a manifold in which a fail occurs. A process space of a sealed atmosphere is provided by a process chamber. A manifold(114,116,118,120) supplies a process gas to the inside of the process chamber. A wafer support part on which a wafer to be processed is placed is installed in the process chamber. A driving part rotates the wafer support part, installed under the wafer support part. A process gas supply part injects a process gas to the surface of the wafer placed on the wafer support part. A manual valve(122,124,126,128) is installed at the front part of the manifold to open/close the manifold by arbitrary manipulation. The process gas can be cleaning gas. The manifold can be made of an aluminum material.
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