PACKAGE STRUCTURE HAVING INSULATOR BLOCKS AND FABRICATION METHOD THEREOF

摘要

A package structure having insulation blocks is provided to protect and isolate wires by forming unevenness like isolation blocks, insulating support blocks and insulating protection blocks on the surface of a substrate in the periphery of chips. A PCB(printed circuit board) has a flat substrate(101) and a plurality of interconnections formed on the front surface of the substrate. One or more chips(103,105) are sequentially stacked on the front surface of the PCB. The interconnections of the PCB are connected to pads of the chips by wires. Isolation blocks(120a) isolate the wires, disposed on the PCB in the periphery of the chips. Insulating support blocks(120c) can be disposed on the PCB in the periphery of the chips to support the wires. Insulating protection blocks(120b) can be disposed outside the interconnection at the edge of the substrate.