| 摘要 |
The present invention relates to a component assembly (100) and to a method of fabricating such a component assembly (100). The component assembly (100) includes a substrate (120), a mount (130) attached to the substrate (120), and a component (110) attached to the mount (130) with solder (140) by melting the solder (140) with light from a light source. The mount (130) is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount (130) to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder (140), the second thermal conductivity being at least 25 % lower than the first thermal conductivity.
|
