| 摘要 |
A packing buffer for stacked bodies for receiving semiconductor package trays is provided to achieve buffering when plural trays for receiving semiconductor package are stacked and packed in a box. Packing buffers for stacked bodies for receiving semiconductor package trays are disposed on the upper and lower surfaces of a stacked body(50). The circumference of the packing buffer(60) is formed in the shape of a flange and the center portion of the packing buffer is formed in the shape of a recess. A separation concave and convex portion(62) is formed on the center of the packed buffer in both directions. Plural buffering concave and convex portions(64,66) are formed on both sides of the separation concave and convex portion. The packing buffer is manufactured in a dry pulp mold type.
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