| 摘要 |
In a conventional composite ceramic substrate, the entire ceramic substrate is bent corresponding to bending of a motherboard. Therefore, when the ceramic substrate is mounted with surface-mounted components such as passive components and active components, these surface-mounted components cannot correspond to the bending of the ceramic substrate. This may cause breaking of wire arisen from disconnection of terminals for external connection of the surface-mounted components from electrodes of the ceramic substrate. The composite ceramic substrate 10 of the present invention includes a ceramic substrate 12 mounted with surface-mounted components 11, external terminal electrodes 14 connecting wiring patterns 13 disposed on the ceramic substrate 12 and surface electrodes of a motherboard 20, and a convex leg portion 15 formed of resin such that an end face supports the external terminal electrodes 14, and the external terminal electrodes 14 are connected to the wiring patterns 13 via a via-hole conductor 15B formed in the leg portion 14. |
