发明名称 |
METHOD FOR MANUFACTURE OF ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL MANUFACTURED BY THE METHOD, SURFACE-TREATED COPPER FOIL MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE MANUFACTURED USING THE ELECTROLYTIC COPPER FOIL OR SURFACE-TREATED COPPER FOIL |
摘要 |
Disclosed is a method for manufacture of an electrolytic copper foil having a lower profile compared to a conventional, commercially available low-profile electrolytic copper foil and also having excellent mechanical strength, with good efficiency. The method may comprise electrolyzing a sulfate-type copper electrolyte solution containing a quaternary ammonium salt polymer having a cyclic structure and a chlorine to form the electrolytic copper foil, wherein the quaternary ammonium salt polymer to be added to the sulfate-type copper electrolyte solution is a DDAC polymer composed of two or more monomer units. Preferably, the quaternary ammonium salt polymer is a diaryldimethylammonium chloride having a number average molecular weight of 300 to 10000. Preferably, the sulfate-type copper electrolyte solution comprises bis(3-sulfopropyl)disulfide or 3-mercapto-1-propanesulfonic acid which has a mercapto group.
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申请公布号 |
KR20080064884(A) |
申请公布日期 |
2008.07.09 |
申请号 |
KR20087012205 |
申请日期 |
2006.10.31 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
DOBASHI MAKOTO;MATSUDA MITSUYOSHI;TOMONAGA SAKIKO;SAKAI HISAO;SAKATA TOMOHIRO;TATEOKA AYUMU;HATA HIROSHI;MOGI SATOSHI;TAGUCHI TAKEO;YOSHIOKA JUNSHI |
分类号 |
C25D3/38;C25C1/12;C25D1/04 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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