| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacture for an inexpensive, highly reliable semiconductor package which is mounted on a small-sized portable unit and is manufactured with improved productivity. SOLUTION: A plurality of wiring patterns for mounting an IC chip and electrode patterns for forming electrodes to be joined to the outside are arranged on an integrated circuit board 1A. Next, an IC chip 6 is mounted on the wiring pattern and is sealed with sealing resin 7. Next, a bump ball electrode 9 to be joined to the outside is formed. This makes an integrated package and fixes the ball electrode 9 of the integrated package to a base member 8. Then the held integrated package is cut along a cut line 2 to form an individual complete semiconductor package. This is the most suitable manufacture for a chip size/ scale package and is superior in reliability and productivity.</p> |
