发明名称
摘要 A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.
申请公布号 JP4114936(B2) 申请公布日期 2008.07.09
申请号 JP20040374585 申请日期 2004.12.24
申请人 发明人
分类号 G02F1/1333;G02F1/1345;G02F1/13;G02F1/133;G09F9/00;H05K5/00;H05K5/04;H05K5/06;H05K7/14 主分类号 G02F1/1333
代理机构 代理人
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