发明名称 |
Integrated electronic component |
摘要 |
An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the comers of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion. |
申请公布号 |
EP1480267(A3) |
申请公布日期 |
2008.07.09 |
申请号 |
EP20040003767 |
申请日期 |
2004.02.19 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
OGAWA, KEIJI;KATO, MITSUHIDE;YAMADA, YOSHINORI |
分类号 |
H01L23/00;H05K5/04;H01L23/04;H01L23/498;H05K5/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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