发明名称 |
Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component |
摘要 |
An electronic component includes a semiconductor chip with a chip topside, an integrated circuit, and a chip backside. The chip backside includes a magnetic layer. The electronic component further includes a chip carrier with a magnetic layer on its carrier topside. At least one of the two magnetic layers is permanently magnetic such that the semiconductor chip is magnetically fixed on the chip carrier.
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申请公布号 |
US7397111(B2) |
申请公布日期 |
2008.07.08 |
申请号 |
US20050291072 |
申请日期 |
2005.12.01 |
申请人 |
INFINEON TECHNOLOGIES, AG |
发明人 |
JEREBIC SIMON;POHL JENS;THEUSS HORST |
分类号 |
H01L23/552;H01L21/00;H01L21/58;H01L23/00;H01L23/482 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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