发明名称 Method of forming a semiconductor thin film
摘要 A method of fabricating a semiconductor thin film is provided, comprising: forming an insulation layer on a semiconductor substrate; etching the insulation layer to form a plurality of openings exposing the substrate at the bottom of the openings; filling the openings with a semiconductor seed layer; forming an amorphous layer on the seed layer and the insulation layer; transforming the amorphous layer to a polycrystalline layer by exposing the amorphous layer to a first laser irradiation at a first energy level; and forming a single semiconductor crystalline film by annealing the polycrystalline layer and the semiconductor seed layer with a second laser irradiation at a second energy level.
申请公布号 US7396744(B2) 申请公布日期 2008.07.08
申请号 US20060481633 申请日期 2006.07.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON YONGHOON;KANG SUNGKWAN;LEE JONGWOOK
分类号 H01L21/00 主分类号 H01L21/00
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