发明名称 |
Method of forming a semiconductor thin film |
摘要 |
A method of fabricating a semiconductor thin film is provided, comprising: forming an insulation layer on a semiconductor substrate; etching the insulation layer to form a plurality of openings exposing the substrate at the bottom of the openings; filling the openings with a semiconductor seed layer; forming an amorphous layer on the seed layer and the insulation layer; transforming the amorphous layer to a polycrystalline layer by exposing the amorphous layer to a first laser irradiation at a first energy level; and forming a single semiconductor crystalline film by annealing the polycrystalline layer and the semiconductor seed layer with a second laser irradiation at a second energy level.
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申请公布号 |
US7396744(B2) |
申请公布日期 |
2008.07.08 |
申请号 |
US20060481633 |
申请日期 |
2006.07.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SON YONGHOON;KANG SUNGKWAN;LEE JONGWOOK |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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