| 发明名称 |
Epoxy resin molding material for sealing use and semiconductor device |
| 摘要 |
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 mum or less and a specific surface area of 3.0 m<SUP>2</SUP>/g or more.
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| 申请公布号 |
US7397139(B2) |
申请公布日期 |
2008.07.08 |
| 申请号 |
US20050552441 |
申请日期 |
2005.10.07 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
IKEZAWA RYOICHI;NARA NAOKI;CHAKI HIDEYUKI;MIZUKAMI YOSHIHIRO;ENDOU YOSHINORI;KASHIHARA TAKAKI;FURUSAWA FUMIO;YOSHII MASAKI;HAGIWARA SHINSUKE;KATAYOSE MITSUO |
| 分类号 |
H01L23/28;H01L21/56;H01L23/29 |
主分类号 |
H01L23/28 |
| 代理机构 |
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