发明名称 SPATTERING AND FILM FORMING METHOD
摘要 A spattering device (1) has first to fourth targets (21a) to (21d). The first and second targets (21a, 21b) are disposed so that their surfaces face each other. The third and fourth targets (21c, 21d) are also disposed so that their surfaces face each other. When a dielectric film is formed, the first and second targets (21a, 21b) and the third and fourth targets (21c, 21d) are alternately spattered. When two of the targets (21a to 21d) with their surfaces facing each other are spattered, the other two of the targets (21a to 21d) function as the earth. As the result, abnormal electric discharge can be suppressed.
申请公布号 KR20080064125(A) 申请公布日期 2008.07.08
申请号 KR20087009280 申请日期 2007.01.16
申请人 ULVAC. INC. 发明人 TAKASAWA SATORU;UKISHIMA SADAYUKI;TANI NORIAKI;ISHIBASHI SATORU
分类号 C23C14/35;C23C14/34 主分类号 C23C14/35
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