发明名称 |
Chip package with die and substrate |
摘要 |
A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments include utilizing glass, glass-metal composite, and glass/glass sandwiched substrates. The substrates form the base for mounting semiconductor dies and fabricating the thin film interconnect structure.
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申请公布号 |
US7397117(B2) |
申请公布日期 |
2008.07.08 |
申请号 |
US20040996535 |
申请日期 |
2004.11.24 |
申请人 |
MEGICA CORPORATION |
发明人 |
LIN MOU-SHIUNG;LEE JIN-YUAN;HUANG CHING-CHENG |
分类号 |
H01L23/053;H01L21/44;H01L21/60;H01L21/68;H01L23/31;H01L23/538 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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