发明名称 |
EPOXY RESIN, EPOXY RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM |
摘要 |
[PROBLEMS] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [MEANS FOR SOLVING PROBLEMS] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50-90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine amount of 5,000 ppm or smaller.
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申请公布号 |
KR20080063843(A) |
申请公布日期 |
2008.07.07 |
申请号 |
KR20087011613 |
申请日期 |
2008.05.15 |
申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA |
发明人 |
NAKANISHI MASATAKA;OSHIMI KATSUHIKO;TANAKA RYUTARO;KURIHASHI TORU |
分类号 |
C08G59/06;C08G59/40;C08L63/00 |
主分类号 |
C08G59/06 |
代理机构 |
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主权项 |
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地址 |
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