发明名称 EPOXY RESIN, EPOXY RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
摘要 [PROBLEMS] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [MEANS FOR SOLVING PROBLEMS] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50-90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine amount of 5,000 ppm or smaller.
申请公布号 KR20080063843(A) 申请公布日期 2008.07.07
申请号 KR20087011613 申请日期 2008.05.15
申请人 NIPPON KAYAKU KABUSHIKI KAISHA 发明人 NAKANISHI MASATAKA;OSHIMI KATSUHIKO;TANAKA RYUTARO;KURIHASHI TORU
分类号 C08G59/06;C08G59/40;C08L63/00 主分类号 C08G59/06
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