| 摘要 |
A reflow curing system for A semiconductor package and a reflow curing method thereof are provided to obtain high quality by curing uniformly semiconductor packages stacked within a magazine. A transfer pallet(5) is loaded in an upper loading unit(10) while a plurality of packages are stacked in a container(3). A reflow chamber(20) is formed to cure a molding part of a stacked package while the transfer pallet is transferred to one side within a hot wind space. A first lifting plate(30) is formed to move the transfer pallet discharged from the reflow chamber in a vertical direction. A cooling unit(40) is positioned at a lower part of the loading unit in order to supply cold wind to the stacked package. A second lifting plate(50) is formed to move the transfer pallet in the vertical direction. A lower unloading unit(60) is installed between the cooling unit and the upper loading unit in order to draw the container from the transfer pallet. |
