METHOD FOR CONNECTING LAYERS, CORRESPONDING COMPONENT AND ORGANIC LIGHT-EMITTING DIODE

摘要

The invention relates to a method for connecting a plurality of layers which each contain at least one thermally connectable material and of which at least one layer sequence has a semiconductor material, by means of a joining layer formed by thermocompression, and to a correspondingly produced component. Furthermore, the invention specifies a method for producing an organic light-emitting diode and an organic light-emitting diode which is encapsulated between two covering layers by means of thermocompression.