ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIP

摘要

An adhesive film for stacking a semiconductor chip is provided to form a firm and stable adhesive layer without an additional spacer by using an ultraviolet hardening process. A first adhesive layer(6) includes a phenoxy resin, an epoxy resin, and a phenol resin. A second adhesive layer(5) is attached to the first adhesive layer. The second adhesive layer is composed of the phenoxy resin and an ultraviolet hardening type low-molecular weight compound. The second adhesive layer includes at least one double bond within molecules in order to increase the elastic modulus of the phenoxy resin by an ultraviolet hardening process. The second adhesive layer further includes an acrylate compound having an ultraviolet hardening function. A third adhesive layer includes the phenoxy resin, the epoxy resin, and the phenol resin.