| 摘要 |
PURPOSE: A structure for improving heat conductivity and brightness of a light emitting diode is provided to improve a heat radiation effect by forming at least one column hole such that the column hole functions as a path for air convection. CONSTITUTION: A bracket(10A) has a cathode leg support part(11). A bowl(12A) is formed in the upper end of the cathode leg support part so that a light emitting chip is settled in the bowl. At least one recess(121) is formed in the bottommost part of the bowl in which adhesive is received, including an opening facing the chip. The opening has a diameter or area smaller than the bottom surface of the chip. While a process is performed, the adhesive is filled in the recess to preliminarily attach the chip. |
