| 摘要 |
PURPOSE: A semiconductor discrete package is provided to be capable of reducing the thickness of the package while preventing the generation of short circuit when loading the package on a PCB(Printed Circuit Board) and restraining the increase of fabrication cost by improving the structure of the package. CONSTITUTION: A lead frame includes the first lead(210), the second lead(220), the third lead, the first lead wire bonding part(212) connected with the first lead, a chip paddle(222) connected with the second lead, and the third lead wire bonding part connected with the third lead. At this time, the first, second and third lead are separated with each other, and the upper portions of the first lead wire bonding part, the chip paddle, and the third lead wire bonding part are exposed through the upper surface of a semiconductor discrete package(200). The semiconductor discrete package is provided with the lead frame, a semiconductor chip(240) attached on the lower portion of the chip paddle, a wire(250) for connecting the semiconductor chip, and the first and third lead wire bonding part, and an EMC(Epoxy Molding Compound) part(260). |
