| 摘要 |
<p>A flip chip package is provided to prevent a crack in a junction by electrically connecting a semiconductor chip to a printed circuit board only using a stud bump. Plural connection pads(310) are formed on an upper surface of a printed circuit board(308). Plural ball lands(312) are formed on a lower surface of the printed circuit board. A first stud bump is formed on each connection pad of the printed circuit board. A semiconductor chip(300) is flip-chip-bonded on the printed circuit board in a face down type. Plural bonding pads(302) are formed on a surface of the semiconductor chip. A second stud bump is formed on each boding pad of the semiconductor chip. The semiconductor chip is flip-chip-bonded by bonding the first stud bump of the printed circuit board and the second stud bump. A sealing member(314) fills a gap between the printed circuit board and the semiconductor chip. A sealing member(316) seals an upper surface of the printed circuit board including the semiconductor chip. A solder ball(318) is attached to the ball land formed on the lower surface of the printed circuit board.</p> |
