| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive film composite showing a high conductivity without requiring heating or by heating at a low temperature at manufacture, and capable of forming on a substrate with inferior thermal resistance. SOLUTION: The conductive film composite is composed of a substrate, an acceptance layer containing at least porous inorganic filler, and a conductive film formed by coating and drying a metal (excluding palladium) colloid liquid. The acceptance layer and the conductive film are in contact and the acceptance layer is formed on the substrate and the conductive layer is formed on the top of the acceptance layer. COPYRIGHT: (C)2008,JPO&INPIT
|
